Competition invites developers to create the next official Autodesk University device
PHOENIX – Hackster.io, an Avnet community, in partnership with Autodesk, Arduino, Qualcomm and PCBWay, has launched a new competition challenging developers, engineers and makers to design the next official product for Autodesk University 2027. The winning concept will be manufactured and distributed to approximately 750 attendees at Autodesk University 2027.
Using Autodesk Fusion, the Arduino® UNO™ Q and support from PCBWay, participants are invited to create connected devices that enhance how people interact with themselves, their environment or others. From wearable technology and assistive devices to AI-powered accessories and pocket-sized productivity tools, the competition encourages developers to apply engineering and design skills to create practical solutions with real-world value.
"The Hackster community continues to push the boundaries of what is possible when creativity, engineering and emerging technologies come together," said Dianne Kibbey, Senior Director, Community Strategy and Hackster.io at Avnet. "This challenge gives developers the opportunity to bring an innovative product concept to life while designing something that could ultimately reach hundreds of Autodesk University attendees. We're excited to see the ideas our community creates."
The competition builds on a tradition of custom devices created for Autodesk University. Previous products have included an air quality meter, a digital conference badge, a macropad and a multi-measure device capable of measuring angle, distance, level and color. This year's challenge encourages participants to develop compact, connected products that are useful not only at Autodesk University but in everyday life.
In addition to the grand prize for Best AU 2027 Product Concept, awards will be presented for Best Fusion Electronics Design and Best Use of the Arduino UNO Q. Projects will be evaluated based on innovation, technical execution, creativity and overall production potential.
Selected participants will receive hardware support to develop their concepts using Autodesk Fusion, the Arduino UNO Q and funding from PCBWay. Entries may incorporate a range of manufacturing approaches, including injection molding, 3D printing, CNC machining and custom PCB design.
For more information and to register, visit https://www.hackster.io/contests/autodesk-university-2027-product.
About Hackster.io
Hackster.io, an Avnet community, is the world’s largest network of hardware and embedded developers where more than 2 million members come to learn, program, build and share electronics projects. Avnet’s ecosystem provides support to bring fresh ideas to market, with access to a network of 300-plus supplier partners, global supply chain expertise and technical know-how, guiding the journey from prototype to production.